Process for making thick multilayers of polyimide

Coating processes – Electrical product produced – Metal coating

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427379, 427404, 4274071, B05D 512

Patent

active

051377519

ABSTRACT:
A polyimide layer having a thickness greater than about 5 microns is formed on a substrate by coating a substrate with a solution of polymer and a solvent of the formula ##STR1## wherein R.sub.1 and R.sub.2 are independently a hydrogen, a C.sub.1 to C.sub.6 alkyl moiety, or a ##STR2## R.sub.5 is a C.sub.1 to C.sub.6 alkyl moiety; and R.sub.3 and R.sub.4 are independently hydrogen or a C.sub.1 to C.sub.6 alkyl moiety, and curing the resulting coated substrate.

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