Process for making semiconductor wafer

Details Process for making semiconductor wafer Process for making semiconductor wafer

1997-03-27

1998-05-26

Breneman, R. Bruce

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

216 52, 216 89, H01L 4122

Patent

active

057563993

ABSTRACT:
The present invention provides a process for making a semiconductor wafer, including slicing an ingot to obtain wafers; surface-grinding both sides of each of the wafers; etching the wafers with an alkaline solution; chamfering the peripheral portion of each of the wafers; both-side polishing the wafers for mirror processing ; cleaning both sides of each of the wafers to remove the particles attached to the sides; and drying and cleaning the wafers. By employing the present process, the time for polishing the wafer can be shortened, and the semiconductor wafer can be made effectively.

REFERENCES:
patent: 4588473 (1986-05-01), Hisatomi et al.
patent: 5591502 (1997-01-01), Kaneko et al.

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