Process for making doped semiconductors

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156612, 156DIG73, 156DIG89, 427 85, 427 86, C30B 2306, C30B 2700, C30B 3108, C30B 3112

Patent

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044314752

ABSTRACT:
A process for making doped semiconductor bodies in thick sheets by epitaxial growth of a doped monocrystalline semiconductor layer on a substrate body by means of a transfer reaction, the transfer system being so arranged that dead spaces are avoided and that within the transfer system a gradient of maximally 1.degree. C./mm is maintained. The invention makes it possible to obtain doped layers of larger thickness than heretofore known.

REFERENCES:
patent: 3484302 (1969-12-01), Maeda et al.
patent: 3663722 (1972-05-01), Kamath
patent: 4279669 (1981-07-01), Braun et al.

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