Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1982-03-18
1984-02-14
Garris, Bradley
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156612, 156DIG73, 156DIG89, 427 85, 427 86, C30B 2306, C30B 2700, C30B 3108, C30B 3112
Patent
active
044314752
ABSTRACT:
A process for making doped semiconductor bodies in thick sheets by epitaxial growth of a doped monocrystalline semiconductor layer on a substrate body by means of a transfer reaction, the transfer system being so arranged that dead spaces are avoided and that within the transfer system a gradient of maximally 1.degree. C./mm is maintained. The invention makes it possible to obtain doped layers of larger thickness than heretofore known.
REFERENCES:
patent: 3484302 (1969-12-01), Maeda et al.
patent: 3663722 (1972-05-01), Kamath
patent: 4279669 (1981-07-01), Braun et al.
Holm Claus
Sirtl Erhard
Collard Allison C.
Consortium fur Elektrochemische Industrie GmbH
Galgano Thomas M.
Garris Bradley
LandOfFree
Process for making doped semiconductors does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for making doped semiconductors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for making doped semiconductors will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2373668