Process for making circuit board or lead frame

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

Reexamination Certificate

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Details

C430S311000, C430S312000, C430S313000, C430S318000, C430S319000

Reexamination Certificate

active

07005241

ABSTRACT:
A process for making a circuit board comprises the following steps of: half-etching a metal layer formed on an insulating substrate by means of a first masking which is positioned on an upper surface of the metal layer; applying a positive liquid resist on the half-etched metal layer from an upper side of the first masking; exposing the positive liquid resist with parallel light from the upper side of the first masking and developing the positive liquid resist in such a manner that a part of the positive liquid resist located under the first masking is protected to be unexposed and undeveloped; etching again the metal layer by means of a second masking composed of the first masking and the protected positive liquid resist to form a conductive pattern on the insulating substrate; and removing the first masking and the second masking from the metal layer.

REFERENCES:
patent: 5858622 (1999-01-01), Gearhart
patent: 6130027 (2000-10-01), Hamada
patent: 6222136 (2001-04-01), Appelt et al.
patent: 6357023 (2002-03-01), Co et al.
patent: 6583843 (2003-06-01), Ishino
patent: 6635407 (2003-10-01), Lokhorst et al.
patent: 62-115891 (1987-05-01), None
patent: 2-175825 (1990-07-01), None
patent: 05-121482 (1993-05-01), None

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