Process for making a two-layer film carrier

Details Process for making a two-layer film carrier Process for making a two-layer film carrier

1992-02-18

1993-06-08

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430313, 430316, 430317, 430318, 156643, 156646, 156652, 1566591, 1566611, G03F 736, C23F 102, B44C 122

Patent

active

052178498

ABSTRACT:
A two-layer film carrier for TAB is made from a substrate prepared by forming a copper layer on a polyimide film by additive plating. A photoresist layer is formed on the copper layer, and another photoresist layer on the polyimide film. Both of the photoresist layers are simultaneously exposed to light through a mask applied to each of them to define a desired pattern. The exposed portions of the photoresist layer on the copper layer are subjected to development and postbaking, whereby selected portions of the copper layer are exposed. The exposed portions of the copper layer are additive plated with copper, whereby leads are formed. The exposed portions of the photoresist layer on the polyimide film are subjected to development and postbaking, whereby selected portions of the polyimide film are exposed. The remaining portions of the photoresist layer are removed from the copper layer and the underlying copper layer is etched. The exposed portions of the polyimide film are etched, and the remaining portions of the photoresist layer are removed from the polyimide film.

REFERENCES:
patent: 4259436 (1981-03-01), Tabuchi et al.
patent: 4353778 (1982-10-01), Fineman et al.
patent: 4911786 (1990-03-01), Kindl et al.

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