Process for making a metal seed layer

Details Process for making a metal seed layer Process for making a metal seed layer

2006-06-27

2008-11-04

Lebentritt, Michael S (Department: 2829)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S637000, C438S643000, C438S653000, C438S656000, C438S677000, C257SE21170, C257SE21168, C257SE21587

Reexamination Certificate

active

07446034

ABSTRACT:
An exemplary method includes: providing a substrate with an exposed metal surface, performing a reducing process on the metal surface, and transferring the substrate in an inert or reducing ambient to a chamber for that is used for metal layer deposition.

REFERENCES:
patent: 5749975 (1998-05-01), Li et al.
patent: 5980977 (1999-11-01), Deng et al.
patent: 6022669 (2000-02-01), Uchida et al.
patent: 6204192 (2001-03-01), Zhao et al.
patent: 6207553 (2001-03-01), Buynoski et al.
patent: 6218303 (2001-04-01), Lin
patent: 6475902 (2002-11-01), Hausmann et al.
patent: 6495453 (2002-12-01), Brongersma et al.
patent: 6613697 (2003-09-01), Faur et al.
patent: 6713377 (2004-03-01), Lee et al.
patent: 6743473 (2004-06-01), Parkhe et al.
patent: 2004/0126713 (2004-07-01), Shiraishi et al.
patent: 2004/0211357 (2004-10-01), Gadgil et al.
patent: 2004/0214424 (2004-10-01), Chuang
patent: 2005/0009325 (2005-01-01), Chung et al.
patent: 2005/0023698 (2005-02-01), Lee
patent: 2005/0095830 (2005-05-01), Weidman et al.
patent: 2006/0003570 (2006-01-01), Shanmugasundram et al.
patent: 2007/0037389 (2007-02-01), Chen et al.
patent: 2007/0082473 (2007-04-01), Shih et al.
Research Intelligence: Novel cluster tool at http://www.liv.ac.uk/researchintelligence/issue1/cluster.html, 1999, 3 pages.
Micro: Reality Check at http://www.micromagazine.com/archive/04/04/reality.html, 2003, 4 pages.
Electronic News—The Fab Line—Jun. 25, 2001—Electronic News—CA90465, at http://www.reed-electronics.com/electronicnews/article/CA90465, html; 4 pages.
CVD Equipment Corporation at http://www.cvdequipment.com/furnaces/htm, Sep. 29, 2005, 3 pages.
Lee et al., “Evolution of PVD-deposited Cu alloys for interconnect applications”, Advances in Electronics Manufacturing Technology, V-EMT 1:16 (Jul. 12, 2004), 4 pages.
Pollution Prevention in the Plating Process, Metal Finishing Industry at http://www.p2pays.org/ref/03/02454/plating.htm, Sep. 27, 2005, 73 pages.
Xing Chen et al, Semiconductor Magazine, CVD: Cleaning, Advances in Remote Plasma Sources For Cleaning 300 mm and Flat Panel CVD Systems, Aug. 2003, 6 pages.
Shenzhen Goldenhouse Vacuum Technology Co., Ltd. at http://www.china-goldenhouse.cn
ews/en
ews—detail.asp?id=133, Sep. 27, 2005, 1 page.

Affiliated with

Also associated with

Rating

Process for making a metal seed layer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for making a metal seed layer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for making a metal seed layer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4039206