Compositions – Heat-exchange – low-freezing or pour point – or high boiling... – Organic components
Patent
1991-09-13
1993-05-25
Skane, Christine
Compositions
Heat-exchange, low-freezing or pour point, or high boiling...
Organic components
252 73, 252 74, 252 77, 252 781, 252 783, C09K 500
Patent
active
052137040
ABSTRACT:
A process for making a compliant thermally conductive, preferably dielectric, compound that enhances the power dissipation capability of high-powered electrical components such as bipolar VLSI semiconductor chips. The compound has chemically stable thermal conduction and viscosity properties; is not subject to phase separation during use and may be applied in small gaps to maximize thermal conduction. The compound preferably comprises a liquid carrier having thermal filler particles dispersed therein and a coupling agent having a functionality which is reactive with the calcined surface of the thermal filler particles, and a functionality having preferential wetting of the thermal filler particles over self-condensation. Additional additives such as fumed silica and polyisobutylene enhance the phase stability and resistance to thermo-mechanical shear force degradation of the thermally conductive compound encountered during functional usage, e.g., fluctuating power cycles.
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Aakalu et al, "IBM Technical Disclosure Bulletin", vol. 24, No. 7A, p. 3530, Thermal Grease with Boron or Aluminum Nitride and Mineral Oil, Dec. 1981.
Lacombe et al, "IBM Technical Disclosure Bulletin", vol. 25, No. 11A, pp. 5740-5743, Flexible Heat-Conducting Sheet Material for Semiconductor Packages, Apr. 1983.
Anderson, Jr. Herbert R.
Booth Richard B.
David Lawrence D.
Neisser Mark O.
Sachdev Harbans S.
Blecker Ira David
International Business Machines - Corporation
Skane Christine
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