Process for integrated circuit wiring

Details Process for integrated circuit wiring Process for integrated circuit wiring

1997-11-12

2000-09-12

Utech, Benjamin L.

Semiconductor device manufacturing: process

Chemical etching

Combined with coating step

438745, 438754, 427 98, 427304, 430313, 430314, 20419215, H01L 21311

Patent

active

061177849

ABSTRACT:
Metal wiring is provided in an integrated circuit by sputter coating onto a semiconductor substrate a copper seed layer; depositing and patterning a photoresist; electroplating or electrolessly plating a metal within the openings of the photoresist; stripping the remaining photoresist; and etching the copper seed layer with an etchant that preferentially etches the copper seed layer at a rate higher than that for the electroplated or electrolessly plated metal.

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