Process for insulating the interconnections of integrated circui

Details Process for insulating the interconnections of integrated circui Process for insulating the interconnections of integrated circui

1981-02-18

1982-10-26

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29580, 156643, 156651, 1566591, 1566611, 204192EC, 357 56, 427 93, H01L 21306, H01L 21312, C23F 102

Patent

active

043560563

ABSTRACT:
The invention relates to integrated circuits in which each component is formed in an active layer, supported by an island, called mesa, of the substrate.
With a view to forming a dielectric layer on the surface of the substrate and on the sides of the mesas, the components are protected by means of a metal layer, then the mesas are hollowed out with slight underetching under the metal layer. The dielectric is deposited on the whole of the surface of the circuit, by cathode spraying, which allows the part of the metal layer to be spared in its underetched periphery. Chemical attack, from the underetching, eliminates the metal layer and the dielectric which it supports.

REFERENCES:
patent: 3669773 (1972-06-01), Levi
patent: 3923975 (1975-12-01), Calviello
patent: 4028140 (1977-06-01), Summers et al.
patent: 4162203 (1979-07-01), Eden et al.

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