Process for improving the solderability of electric circuit boar

Details Process for improving the solderability of electric circuit boar Process for improving the solderability of electric circuit boar

1976-07-08

1977-09-06

Esposito, Michael F.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156651, 156901, 134 3, 134 41, 252 791, 252 792, 252 794, 427 96, 427309, 427327, C23F 100, B44C 122

Patent

active

040466205

ABSTRACT:
A process is provided for improving the solderability of electric circuit boards with conductor paths composed of copper or copper alloys, in which, at least at the locations to be soldered, the conductor paths are cleansed in a first solution and are thereby deoxidized, and are then activated in a second solution.

REFERENCES:
patent: 3020175 (1962-02-01), Penczek
patent: 3367875 (1968-02-01), Sherer
patent: 3887405 (1975-06-01), Fong

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