Paper making and fiber liberation – Processes of chemical liberation – recovery or purification... – Waste paper or textile waste
Patent
1980-09-30
1982-04-27
Smith, William F.
Paper making and fiber liberation
Processes of chemical liberation, recovery or purification...
Waste paper or textile waste
162 55, 210702, 209 4, D21C 502
Patent
active
043269125
ABSTRACT:
The method removes a contaminant, such as adhesive or ink particles, from wastepaper pulp. The method includes the steps of dispersing a monomer in the pulp so as to form droplets or beads which take up the particles e.g. by a process in which the particles are coated, absorbed or dissolved by, or adhere to the droplets or beads of monomer. The monomer is then polymerized to increase the rigidity of the droplets or beads, and the droplets or beads are separated from the pulp, e.g. by screening. The monomer or a mixtures of monomers are dispersed in the pulp by strong mechanical agitation and the agitation can be controlled to provide droplets or beads of monomer within a certain size range. Suitable monomers includes styrene, vinyl acetate, methyl methacrylate or mixtures of the same. The viscosity of the monomer phase may be increased by dissolving a homopolymer in the monomer to reduce the effect of shear forces caused by agitation. Benzoyl peroxide may be added to initiate polymerization.
REFERENCES:
patent: 4013505 (1977-03-01), Balcar et al.
patent: 4076578 (1978-02-01), Puddington et al.
patent: 4221634 (1980-09-01), Frost
Pira, The Research Association for the Paper and Board, Printing
Smith William F.
LandOfFree
Process for improving the quality of pulp obtained from wastepap does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for improving the quality of pulp obtained from wastepap, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for improving the quality of pulp obtained from wastepap will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2196490