Process for improved quality of CVD copper films

Details Process for improved quality of CVD copper films Process for improved quality of CVD copper films

1996-06-20

1997-09-23

King, Roy V.

Coating processes

Coating by vapor, gas, or smoke

Metal coating

4272551, 4272481, 427314, 427124, C23C 1600

Patent

active

RE0356140

ABSTRACT:
Chemical Vapor Deposition of copper films is enhanced by simultaneously introducing in the reactor vapor of an organometalic copper precursor and ligand.

REFERENCES:
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patent: 5094701 (1992-03-01), Norman et al.
patent: 5098516 (1992-03-01), Norman et al.
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Jain, et al., "Chemical Vapor Deposition of Copper from Hexafluoroacetylacetonato Copper (I) Vinyltsimethylsilane" J. Electrochem. Soc., vol. 140, No. 5, May 1993. pp. 1434-1439.
Donnelly, et al., "Copper Metalorganic Chemical Vapor Deposition Reactions of Hexafluoroacetylacetonate Cu(I) Vinyltrimethylsilane and bis (hexafluroracetylacetonate) Cu(II) adsorbed on titanium nitride" J. Vac. Sci. Technol. A 11(1), Jan./Feb. 1993, pp. 66-77.

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