Process for forming printed circuit film used in waterproof...

Details Process for forming printed circuit film used in waterproof... Process for forming printed circuit film used in waterproof...

2005-02-08

2005-02-08

Deo, Duy-Vu N. (Department: 1765)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S689000, C361S689000, C361S689000

Reexamination Certificate

active

06853544

ABSTRACT:
The present invention provides a process for forming a printed circuit film in a waterproof keyboard. A circuit layer and an insulation layer are provided. The circuit layer has a plurality of contacts and circuits electrically connected to the contacts. The contacts are located respectively corresponding to keys of a keyboard. The circuits are located respectively corresponding to the contacts. Then, the circuit layer is folded and then the insulation layer is interleaved between the folded circuit layer. Thereafter, the insulation layer is laminated with the circuit layer.

REFERENCES:
patent: 6467683 (2002-10-01), Jun
patent: 6542355 (2003-04-01), Huang
patent: 6664901 (2003-12-01), Yamada et al.
patent: 6705782 (2004-03-01), Cheng
patent: 20020063149 (2002-05-01), Jun

Affiliated with

Also associated with

Rating

Process for forming printed circuit film used in waterproof... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for forming printed circuit film used in waterproof..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for forming printed circuit film used in waterproof... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3506661