Process for forming multilayer lift-off structures

Details Process for forming multilayer lift-off structures Process for forming multilayer lift-off structures

1994-11-02

1996-04-02

Duda, Kathleen

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430313, 430224, 430329, G03F 726

Patent

active

055039618

ABSTRACT:
A process is disclosed for forming multilayered polyimide structure from negative photosensitive polyimide precursors. An initial polyimide layer is deposited and imagewise exposed. The unexposed portions of the initial polyimide layer are inhibited and then a second polyimide layer is deposited and likewise imagewise exposed. The films are developed, thereby forming a multilayer polyimide structure. After formation of the multilayer polyimide structure, a conductive material is applied on a substrate and then the polyimide layers are lifted off thereby forming a desired pattern of metallization.

REFERENCES:
patent: 4533624 (1985-08-01), Sheppard
patent: 4606998 (1986-08-01), Clodgo et al.
patent: 5006488 (1991-04-01), Previti-Kelly
patent: 5229257 (1993-07-01), Cronin
patent: 5266446 (1993-11-01), Chang

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