Process for forming microcircuits

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156646, 156657, 1566591, 204192E, 427341, 430 5, 430313, 430317, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

042895731

ABSTRACT:
The resistance of a resist of plasma etching is enhanced by first cross-linking the resist and then contacting it with an aqueous solution of NaOH or KOH. The process is useful to form microcircuits having increased density of geometry.

REFERENCES:
patent: 4078102 (1978-03-01), Bendz et al.
patent: 4093461 (1978-06-01), Loprest et al.
patent: 4208211 (1980-06-01), Bowden

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