Process for forming fine patterns

Details Process for forming fine patterns Process for forming fine patterns

1984-05-03

1985-03-05

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156646, 156652, 156655, 1566591, 156667, 156668, 156904, 204192E, B44C 122, C03C 1500, C03C 2506, B29C 1708

Patent

active

045029164

ABSTRACT:
Fine patterns are formed by a process wherein a workpiece is spin coated with a heat-resistant resin layer, this resin layer is spin coated with an organotitanium or titanium oxide layer, a resist pattern is formed on the organotitanium or titanium oxide layer, the organotitanium or titanium oxide layer is etched by ion etching with the resist pattern as a mask, and finally, the resin layer is etched by using the etched organotitanium or titanium oxide layer as a mask.

REFERENCES:
patent: 4132586 (1979-01-01), Schaible et al.
patent: 4288283 (1981-09-01), Umezaki et al.
patent: 4362598 (1982-12-01), Griffing
patent: 4390394 (1983-06-01), Mathuni et al.
Solid State Technology, Aug. 1981, pp.74-80, Multilayer Resist Systems for Lithography, M. Hatzakis.
J. Vac. Sci. Technol., 16(6), Nov./Dec. 1979, pp. 1620-1624, High Resolution Steep Profile Resist Patterns, J. M. Moran et al.

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