Process for forming conductive through-holes through a dielectri

Details Process for forming conductive through-holes through a dielectri Process for forming conductive through-holes through a dielectri

1983-12-05

1985-05-14

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29853, 29882, 156644, 156645, 156652, 156902, 174 685, 427 97, 430313, 430317, 430318, B44C 122, C03C 1500, C03C 2506, C23F 102

Patent

active

045170509

ABSTRACT:
A conductive through-hole hole is formed through a dielectric sandwiched between conductors by forming a noncircular hole in a conductor, etching a hole through the dielectric and by deforming at the conductor which has been undercut during the etching.

REFERENCES:
patent: 2974284 (1961-03-01), Parker
patent: 3186883 (1965-06-01), Frantzen
patent: 3557446 (1971-01-01), Charschan
patent: 3969815 (1976-07-01), Hacke et al.
patent: 4023999 (1977-05-01), Lindberg et al.
patent: 4184909 (1980-01-01), Chang et al.
patent: 4289573 (1981-09-01), Economy et al.
patent: 4319708 (1982-03-01), Lomerson
J. W. Coburn, "Plasma Etching", pp. 1-7.
CPI Prior Art Search Report, J. P. Daniszewski, pp. 2-8.

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