Process for forming and locating buried layers

Details Process for forming and locating buried layers Process for forming and locating buried layers

1984-03-19

1984-12-11

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29580, 148175, 148187, 156651, 156653, 156657, 156662, 1566611, 427 85, 427 86, 430313, B44C 122, C03C 1500, B05D 512, H01L 736

Patent

active

044876530

ABSTRACT:
A method for forming vertically spaced apart regions on an integrated circuit substrate is disclosed. One or more recesses are formed in inactive regions of the substrate, while the remaining surface of the substrate remains substantially flat. When an epitaxial layer is deposited over the substrate, the recesses in the substrate causes the formation of corresponding recesses in the exposed surface of the epitaxial layer. Such recesses are useful as alignment marks in properly locating the masks used in defining active regions on the surface of the epitaxial layer.

REFERENCES:
patent: 4125418 (1978-11-01), Vinton
patent: 4233091 (1980-11-01), Kawabe
patent: 4251300 (1981-02-01), Caldwell
patent: 4309813 (1982-01-01), Hull

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