Process for forming and crimping a bead

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

72148, 140 88, B29D 3048, B21D 4706, B21D 4732

Patent

active

047598131

ABSTRACT:
A bead former (14) has a gripping mechanism (90,92) for gripping a leading end (106) of a bead ribbon (12) at a position recessed in the surface (18) of the former (14) during the initial rotation of the former (14). The gripping mechanism (90,92) has a seat member (92) movable radially outward of the former (14) into a supporting position at the surface (18) of the former (14) after releasing the leading end (106) for supporting the leading end (106) during the latter rotation of the former (14). A pressure roller (20) is rotatably supported in a guide cage (54) mounted on a dual arm (22,48) having a dual actuation system (34,60) for moving the guide cage (54) and pressure roller (20) into position for guiding and compacting the convolutions of bead ribbon (12) wrapped around the former (14) and for providing a high pressure force to crimp the splice area (124 ) of the bead (16). A bead handling mechanism is provided to remove and accumulate the beads (16) in a spaced condition on belts (180) of unloading fingers (125) from the bead former (14).

REFERENCES:
patent: 1635187 (1927-07-01), Lough et al.
patent: 1855426 (1932-04-01), Stevens
patent: 2083350 (1937-06-01), Shook
patent: 2151306 (1939-03-01), Shook
patent: 2190805 (1940-02-01), Shook
patent: 2587517 (1952-02-01), Paxson
patent: 2821348 (1958-01-01), Langen
patent: 2902083 (1959-09-01), White
patent: 2920837 (1960-01-01), Wingard
patent: 2979109 (1961-04-01), Dieckmann
patent: 2996107 (1961-08-01), Dieckmann
patent: 3051221 (1962-08-01), Strozewski
patent: 3330491 (1967-07-01), Williams
patent: 3429765 (1964-10-01), Mallory et al.
patent: 3528162 (1970-09-01), Sagara
patent: 4219375 (1980-08-01), Vandale et al.
patent: 4452660 (1984-06-01), Davies et al.
patent: 4496411 (1985-01-01), Davies et al.
patent: 4597157 (1986-07-01), Ichikawa

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for forming and crimping a bead does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for forming and crimping a bead, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for forming and crimping a bead will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-256567

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.