Process for forming a circuit substrate

Details Process for forming a circuit substrate Process for forming a circuit substrate

1988-09-06

1989-09-19

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29848, 156634, 156656, 1566591, 156902, 204 30, 204 351, 204 20, 2642711, 427 98, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

048678392

ABSTRACT:
A process for forming a circuit substrate comprising placing an electrodeposited metal foil having a rough surface provided with a large number of fine projections in a cavity of a mold in such a manner that the rough surface faces an inside of the mold cavity; pouring a melting resin into the mold cavity to form a molded article; peeling the metal foil from the molded article to form a large number of fine concavities corresponding to the projections; electroless-plating the resin base to form a metal film; and photoetching to form a circuit pattern on the resin base.

REFERENCES:
patent: 4774122 (1988-09-01), Adler

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