Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1996-05-09
1997-05-27
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
4273855, 528310, 528332, 528503, B05D 512, C08G 6914
Patent
active
056330340
ABSTRACT:
The invention relates to a process for forming a circuit assembly comprising (i) coating onto a substrate a layer of polyamic ester selected from a unique class of polyamic esters; (ii) imidizing the polyamic ester to form a layer of polyimide having an even surface and (iii) forming circuit conductors on the even surface of the polyimide.
REFERENCES:
patent: 4656050 (1987-04-01), Araps et al.
patent: 4845167 (1989-07-01), Alston et al.
patent: 4912238 (1990-03-01), Alston et al.
patent: 5219639 (1993-06-01), Sugawara et al.
patent: 5302851 (1994-04-01), Ree et al.
M. E. Rogers et al., "Semicrystalline and Amorphous Fluorine-Containing Polyimides", Polymer, 1993, vol. 34, No. 4, pp. 849-855.
B. Luther et al., "Planar Copper-Polyimide Back End of the Line Interconnections for ULSI Devices", X VLSI Multilevel Interconnection Conference, Santa Clara, pp. 15-21 (1993).
Carter Kenneth R.
DiPietro Richard A.
Hedrick James L.
Hummel John P.
Miller Robert D.
Beck Shrive
International Business Machines - Corporation
Martin Robert B.
Talbot Brian K.
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