Process for fabricating three-dimensional, free-standing microst

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156644, 156648, 156651, 156655, B44C 122, C03C 1500, C03C 2506

Patent

active

048490709

ABSTRACT:
A sublimable layer is deposited on a substrate, holes are etched through sublimable layer, a thin-layer structure is deposited on portions of the remaining sublimable layer, and a thick structural support material is deposited to cover the sides and bottoms of the holes and portions of the thin-layer structure. When the sublimable layer is sublimed with the heat, photon enhancement (ultraviolet light) and oxygen purging, a structure is left which consists of a thin layer or layers supported by posts above a substrate.

REFERENCES:
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patent: 3846166 (1974-11-01), Saiki et al.
patent: 4262399 (1981-04-01), Cady
patent: 4674180 (1987-06-01), Zavracky et al.
patent: 4740410 (1988-04-01), Muller et al.
patent: 4783237 (1988-11-01), Aine et al.

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