Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1984-05-15
1985-09-17
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29591, 156646, 156652, 156653, 156656, 156657, 1566591, 204192E, 357 71, 427 89, 430317, 430318, C23F 102, B44C 122, C03C 1500, C03C 2506
Patent
active
045418934
ABSTRACT:
A process for fabricating pedestal interconnections between conductive layers in an integrated circuit includes the steps of (a) forming a first conductive layer over a semiconductor substrate; (b) applying a stop etch layer to said first conductive layer, the stop etch layer having a different etch property than the first conductive layer; (c) patterning the first conductive layer and the stop etch layer in an interconnection pattern which includes widened regions wherever a pedestal interconnection is to be formed; (d) selectively etching the stop etch layer until the stop etch layer remains as a stop etch cap only in central sections of the widened regions; and (e) selectively etching the first conductive layer to a selected depth whereby a pedestal is formed underneath the stop etch caps. The following optional steps may be added: (f) applying a layer of an insulating material over the first conductive layer; and (g) planarizing the insulating layer to expose the tips of the pedestals.
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H. W. Lehmann, et al., "Dry Etching for Pattern Transfer", J. Vacuum Science and Technology, vol. 17, No. 5, Sep./Oct. 1980, p. 1177.
D. N. K. Wang, et al., "Reactive-Ion Etching Eases Restrictions on Materials and Feature Sizes", Electronics, Nov. 3, 1983, p. 157.
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Advanced Micro Devices , Inc.
King Patrick T.
Powell William A.
Valet Eugene H.
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