Process for fabricating multilayer printed circuits

Details Process for fabricating multilayer printed circuits Process for fabricating multilayer printed circuits

1992-04-21

1993-11-16

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

1563066, 156629, 156901, 427 98, H05K 336

Patent

active

052611540

ABSTRACT:
For attaining adhesion between copper circuitry innerlayers and pre-preg layers in a multilayer printed circuit, a conversion coating of copper oxide is provided on the metallic copper surfaces in a manner which develops an altered topography of the underlying metallic copper surfaces. Thereafter, a controlled dissolution and removal of a substantial amount of the copper oxide is effected, in a manner which does not adversely affect the already-developed topography of the underlying metallic copper, and such that the innerlayer, at the time of assembly with the pre-preg layers, has copper surfaces consisting of the topographically altered metallic copper and a relatively small amount of copper oxide thereon. Excellent bonding strengths are achieved with decreased incidence of pink ring formation as compared to conventional processes utilizing copper oxide for adhesion promotion. In addition, the copper ion containing solutions resulting from the controlled dissolution and removal of copper oxide can be economically utilized in formulating electroless copper plating baths.

REFERENCES:
patent: 4643793 (1987-02-01), Nakaso et al.
patent: 5106454 (1992-04-01), Allardyce et al.

Affiliated with

Also associated with

Rating

Process for fabricating multilayer printed circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for fabricating multilayer printed circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for fabricating multilayer printed circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-14641