Process for fabricating GaAs FET with ion implanted channel laye

Metal working – Method of mechanical manufacture – Assembling or joining

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29576B, 148 15, 148189, H01L 21324

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active

044739397

ABSTRACT:
There is herein described a process for fabricating GaAs FETs with an ion implanted channel layer wherein an ion implanted substrate is capless annealed under an arsine overpressure, and a relatively shallow portion of the outer surface of the substrate in the active layer is removed for the deposition of a gate metallic electrode.

REFERENCES:
patent: 4058413 (1977-11-01), Welch et al.
patent: 4244097 (1981-01-01), Cleary
patent: 4265934 (1981-05-01), Ladd
patent: 4357180 (1982-11-01), Molnar
patent: 4383869 (1983-05-01), Liu
patent: 4396437 (1983-08-01), Kwok et al.
Kasahara et al., "Capless Anneal of Ion-Implanted GaAs in Controlled Arsenic Vapor, J. Appl. Phys., 50 (1), Jan. 1979, pp. 541-543.

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