Process for fabricating circuitry on substrates having plated th

Details Process for fabricating circuitry on substrates having plated th Process for fabricating circuitry on substrates having plated th

1998-04-02

2000-01-11

Gibson, Sharon

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430313, 430314, 430318, 216 17, 427 97, G03F 700

Patent

active

060134178

ABSTRACT:
Circuitry is formed on a substrate having at least one plated through-hole employing two different photoresist materials. A first photoresist is applied on a conductive layer located on a substrate and is developed to define a desired conductive circuit pattern. A second photoresist is laminated onto the structure and is developed so that the second photoresist material remains in the vicinity of the through-hole. The conductive layer is etched to provide the desired circuit pattern, and the remaining portions of the second and first photoresists are removed.

REFERENCES:
patent: 4566186 (1986-01-01), Bauer et al.
patent: 4911796 (1990-03-01), Reed
patent: 4945029 (1990-07-01), Bronnenberg
patent: 4983252 (1991-01-01), Masui et al.
patent: 5270903 (1993-12-01), McMichen et al.
patent: 5277929 (1994-01-01), Seki et al.
patent: 5427895 (1995-06-01), Magnuson et al.
patent: 5707893 (1998-01-01), Bhatt et al.

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