Process for fabricating an integrated electronic circuit...

Details Process for fabricating an integrated electronic circuit... Process for fabricating an integrated electronic circuit...

2007-02-06

2007-02-06

Nguyen, Cuong (Department: 2811)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

C438S619000, C438S624000

Reexamination Certificate

active

10781565

ABSTRACT:
A process for fabricating an integrated electronic circuit comprises the formation of at least one air gap between interconnect elements above only a defined portion of a surface of a substrate, within an interconnect layer. The interconnect layer comprises a sacrificial material and extends beneath an intermediate layer of permeable material. The air gap is formed by removal, through the intermediate layer, of at least part of the sacrificial material by bringing the permeable material into contact with an agent for removing the sacrificial material, to which agent the permeable material is resistant.

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