Process for fabricating an electrical circuit comprising a...

Details Process for fabricating an electrical circuit comprising a... Process for fabricating an electrical circuit comprising a...

2006-06-20

2006-06-20

Geyer, Scott (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S584000, C438S700000

Reexamination Certificate

active

07064053

ABSTRACT:
A process for fabricating an integrated electrical circuit comprises the formation and then the removal of conducting inserts. Components of the electrical circuit are incorporated into insulating materials superposed on top of a substrate. The process makes it possible to provide an exclusion volume around certain components sensitive to electrostatic coupling, while giving each insulating material a planar surface at the end of a polishing step.

REFERENCES:
patent: 6214745 (2001-04-01), Yang et al.
patent: 6232231 (2001-05-01), Sethuraman et al.
patent: 6326309 (2001-12-01), Hatanaka et al.
patent: 6585568 (2003-07-01), Tsuchiya et al.
patent: 6656842 (2003-12-01), Li et al.
patent: 6734080 (2004-05-01), Yang et al.
patent: 2002/0000663 (2002-01-01), Nakayama
patent: 2002/0031879 (2002-03-01), Itoh et al.
patent: 2002/0050655 (2002-05-01), Travis et al.

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