Process for fabricating a single-crystal substrate and...

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Amorphous semiconductor

Reexamination Certificate

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C438S429000, C438S442000, C438S481000

Reexamination Certificate

active

07060596

ABSTRACT:
An initial single-crystal substrate1having, locally and on the surface, at least one discontinuity in the single-crystal lattice is formed. The initial substrate is recessed at the discontinuity. The single-crystal lattice is amorphized around the periphery of the recess. A layer of amorphous material having the same chemical composition as that of the initial substrate is deposited on the structure obtained. The structure obtained is thermally annealed in order to recrystallize the amorphous material so as to be continuous with the single-crystal lattice of the initial substrate.

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Wolf et al., Silicon Processing for the VLSI ERA; Lattice Press, Sunset Beach, CA; 2000, chapter 1, p. 1-34.
Preliminary Search Report dated Sep. 11, 2001 for French Application No. 0100414.

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