Process for fabricating a low dielectric composite substrate

Details Process for fabricating a low dielectric composite substrate Process for fabricating a low dielectric composite substrate

1990-03-30

1992-08-04

Lowe, James

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

264 61, C04B 3700

Patent

active

051355957

ABSTRACT:
The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addresssed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

REFERENCES:
patent: 4865875 (1989-09-01), Kellerman
patent: 4880684 (1989-11-01), Boss et al.
patent: 4915759 (1990-04-01), Moran

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