Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1992-05-11
1994-01-11
Silbaugh, Jan H.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
427 96, 427 97, 427140, 427314, 4273741, 4273722, C04B 3700, B05D 512
Patent
active
052777251
ABSTRACT:
The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.
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Acocella John
Agostino Peter A.
Baise Arnold I.
Bates Richard A.
Bryant Ray M.
Blecker Ira David
Fiorilla Christopher A.
International Business Machines - Corporation
Silbaugh Jan H.
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