Process for etching via holes in alumina

Details Process for etching via holes in alumina Process for etching via holes in alumina

1985-10-29

1986-10-28

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156637, 156655, 1566591, 156667, 252 795, B44C 122, C03C 1500, C03C 2506

Patent

active

046197311

ABSTRACT:
Via holes are etched in an alumina layer using an etchant bath of ethylenediaminetetraacetic acid at a pH above 9.

REFERENCES:
patent: 3923559 (1975-12-01), Sinha
patent: 4251621 (1981-02-01), Fraley et al.
patent: 4339281 (1982-07-01), Chio
patent: 4461818 (1984-07-01), Suzuki et al.

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