Process for etching sloped vias in polyimide insulators

Details Process for etching sloped vias in polyimide insulators Process for etching sloped vias in polyimide insulators

1980-11-06

1983-01-18

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566591, 156668, 252 795, 430317, B44C 122, C03C 1500, C03C 2506

Patent

active

043690904

ABSTRACT:
A method for the fabrication of a cured polyamic acid film having apertures therein selectively etched to provide sidewalls sloped at a controlled angle. Such films are used in the fabrication of integrated circuits having two or more levels of metallization, to provide electrical insulation between metal levels. The apertures therein are required to have sloped sidewalls in order to enhance the yields of circuits having reliable contact between metal levels.

REFERENCES:
patent: 3361589 (1968-01-01), Lindsey
patent: 4039371 (1977-08-01), Brunner et al.
patent: 4113550 (1978-09-01), Saiki et al.

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