Process for etching copper with ammoniacal etchant solution and

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156656, 156666, 252 795, B44C 122, C03C 1500, C03C 2506, C23F 100

Patent

active

049157760

ABSTRACT:
A process for etching copper with an ammoniacal etchant solution and reconditioning the etchant solution which consumes only feeds of oxygen and water for etching copper and only small amount of pollutant is obtained.

REFERENCES:
patent: 4233106 (1980-11-01), Goffredo
patent: 4576677 (1986-03-01), Faul et al.

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