Process for etching copper

Details Process for etching copper Process for etching copper

1983-12-06

1984-08-21

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566591, 156666, 156902, 252 791, 252 794, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

044668597

ABSTRACT:
Process and structure for etching copper, as in the manufacture of printed circuit boards. The copper is exposed to a gaseous or liquid oxidant in the presence of a catalyst which promotes the reaction of copper with the oxidant. In some embodiments, the catalyst is carried by a medium which also serves as a receiver for oxidized copper species produced by the reaction, and in one preferred embodiment, the medium comprises a laminated structure having a first layer which contains a catalyst and a second layer which receives the oxidized copper species. The etching is substantially anisotropic, which alleviates the problem of undercutting.

REFERENCES:
patent: 2428464 (1947-10-01), Lum et al.
patent: 2908557 (1959-10-01), Black et al.

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