Process for etching and preparing nickel-polyester offset printi

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

101465, 101466, 1566591, 156664, 156905, 430302, 430310, B41C 100, B41N 302

Patent

active

042331102

ABSTRACT:
Process for etching a nickel-polyester layered offset plate, which is made by electroless nickel-plating of polyester and subsequently coated on the nickel-layer by a photoresist layer. After exposure of the photoresist layer under a transparent master and development of the offset-plate, the offset-plate is etched by an aqueous etching solution containing copper(II) ions, as the only etching agent together with Cl.sup.- ions. An offset printing plate is prepared from the etched nickel-polyester layered plate. The nickel layer of the nickel-polyester layered plate is etched with the aqueous etching solution. The etching solution additionally contains:

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