Process for equipment to coat tools for machining and forming te

Details Process for equipment to coat tools for machining and forming te Process for equipment to coat tools for machining and forming te

1986-08-15

1989-10-03

Boeker, Richard

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20419215, 204298, C23C 1434

Patent

active

048714348

ABSTRACT:
Process and apparatus for coating a tool with a layer of a compound which contains at least one of carbon and nitrogen and at least one of titanium, zirconium, chromium, tungsten, tantalum, vanadium, niobium, hafnium and molybdenum. The apparatus includes a vacuum chamber and a substrate holder for accommodating at least one tool with the substrate holder at a bias of between -40 and -200 V relative to ground. The apparatus includes at least two magnetron sputtering cathodes disposed in mirror symmetry to the substrate holder. The target contains at least one metal selected from the group consisting of T, Zr, Cr, W, Ta, V, Nb, Hf and Mo. The apparatus includes at least one gas source for supplying the vacuum chamber with a noble gas and a reaction gas. The reaction gas contains at least one of nitrogen and a gaseous carbon compound. The apparatus includes at least one anode in the edge region of each target so that the anodes are positioned in mirror symmetry with respect to the target holder. Each of the anodes is connected to a voltage means for applying a voltage of +10 to +200 V relative to ground.

REFERENCES:
patent: 4183797 (1980-01-01), Kennedy et al.
patent: 4544468 (1985-10-01), Munz et al.
Waits, "Planar Magnetron Sputtering", from Thin Film Processes, (Vossen & Kern Eds., Academic Press, N.Y.), 1978, pp. 131-173.

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