Process for electroless copper plating

Details Process for electroless copper plating Process for electroless copper plating

1985-06-18

1986-12-30

Hayes, Lorenzo B.

Coating processes

Immersion or partial immersion

Metal base

106 123, 106 126, 4274431, C23C 302

Patent

active

046328521

ABSTRACT:
In a process for electroless copper plating in an electroless copper plating solution containing a copper salt, a complexing agent for the copper salt, a reducing agent for the copper salt, and a pH-adjusting agent, a plating film having distinguished mechanical properties can be obtained by adding at least one of soluble inorganic silicon compounds and soluble inorganic germanium compounds and conducting the electroless copper plating by injecting an oxygen-containing gas into the plating solution or by adding an oxidizing agent to the plating solution or by both injection or the oxygen-containing gas and addition of the oxidizing agent thereto. The stability of the electroless copper plating solution can be maintained better thereby and substantially thick plating is possible.

REFERENCES:
patent: 2938805 (1960-05-01), Agens
patent: 3915717 (1975-10-01), Feldstein et al.
patent: 4152467 (1979-05-01), Alpaugh et al.

Affiliated with

Also associated with

Rating

Process for electroless copper plating does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for electroless copper plating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for electroless copper plating will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1546877