Process for electrically connecting electrical devices using a c

Details Process for electrically connecting electrical devices using a c Process for electrically connecting electrical devices using a c

1995-08-28

1997-08-26

Graybill, David E.

Semiconductor device manufacturing: process

With measuring or testing

Electrical characteristic sensed

438119, 324757, 156325, H01L 21288, H01L 2158, H01L 2160

Patent

active

056610424

ABSTRACT:
A process for using removable Z-axis anisotropically conductive adhesive material (21) which includes water, a matrix resin (23), and conductive spheres (22). The material (21) is suitable for providing temporary contact between electronic devices. In one embodiment, the material (21) is used to temporarily bond a semiconductor wafer (11) to a probe substrate (12) for wafer-level burn-in.

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SPIE (The Society of Photo-Optical Instumentation Engineers) International Conference and Exhibition; Multichip Modules; Apr. 13-15, 1994, Denver Colorado, vol. 2256, pp. iv-viii and 34-40.

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