Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1993-06-22
1994-09-20
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156643, 156646, 156665, 20419233, 437 7, 437 8, H01L 2100, G01N 2100
Patent
active
053486145
ABSTRACT:
A process for dynamically adjusting the concentration of one or more reactants in a plasma assisted process, such as a plasma etch process or a plasma deposition process, is described. The concentration of one or more reactants, as well as the concentration of a non-reactive gas, in a plasma enhanced process for the formation of an integrated circuit structure is quantitatively monitored by actinometry to derive a ratio of such concentrations of reactant to non-reactant. The concentration of the reactant or reactants in the plasma processing chamber is then maintained in the chamber by adjusting the flow of such reactant or reactants into the chamber based on changes in such ratio based on such continuous quantitative monitoring of the both the concentration of the reactant or reactants and that of the non-reactive (non-changing concentration) component.
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patent: 4430151 (1984-02-01), Tsukada
patent: 4457820 (1984-07-01), Bergeron et al.
patent: 4704199 (1987-11-01), Yokokawa et al.
Khoury, "Real-Time Etch Plasma Monitor System", IBM Technical Disclosure Bulletin, vol. 25 No. 11A Apr. 1983.
Auciello, Orlando, et al., "Optical Diagnostic Techniques for Low Pressure Plasmas and Plasma Processing", Plasma Diagnostics, vol. 1, Boston: Academic Press, Inc., 1989, pp. 1-46.
Dang Thi
LSI Logic Corporation
Taylor John P.
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