Process for dressing molded array package saw blade

Details Process for dressing molded array package saw blade Process for dressing molded array package saw blade

2005-06-07

2005-06-07

Elve, M. Alexandra (Department: 1725)

Electric heating

Metal heating

By arc

C219S121850

Reexamination Certificate

active

06903304

ABSTRACT:
A process for reworking or dressing a saw blade used in wafer dicing and singulation of molded array integrated circuit packages, includes rotating the saw blade on a spindle and ablating an edge portion of the saw blade using a laser and thereby dressing the saw blade.

REFERENCES:
patent: 4488882 (1984-12-01), Dausinger et al.
patent: 4776251 (1988-10-01), Carter, Jr.
patent: 6229200 (2001-05-01), Mclellan et al.
patent: 6413150 (2002-07-01), Blair
patent: 6422229 (2002-07-01), Padrinao et al.
patent: 20030199165 (2003-10-01), Keenan et al.

Affiliated with

Also associated with

Rating

Process for dressing molded array package saw blade does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for dressing molded array package saw blade, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for dressing molded array package saw blade will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3474680