Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2006-12-28
2009-06-09
Sarkar, Asok K (Department: 2891)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
C438S689000, C257S622000, C257SE21553
Reexamination Certificate
active
07544620
ABSTRACT:
A process for digging deep trenches in a body of semiconductor material includes forming a mask having an opening, above a surface of a semiconductor body. A passivating layer is conformally formed on the mask and on the semiconductor body within the opening. A directional etch is extended to first remove the passivating layer from on top of the semiconductor body and then etch the semiconductor body through the opening. Forming the passivating layer and executing the directional etch are carried out repeatedly in sequence so as to form a trench through the opening. A tapered portion of the trench is formed, which has a transverse dimension decreasing as a distance from the surface of the semiconductor body increases.
REFERENCES:
patent: 6187685 (2001-02-01), Hopkins et al.
patent: 6261962 (2001-07-01), Bhardwaj et al.
patent: 6284148 (2001-09-01), Laermer et al.
patent: 7354786 (2008-04-01), Benzel et al.
patent: 2003/0168711 (2003-09-01), Villa et al.
patent: 2004/0198064 (2004-10-01), Subramanian et al.
patent: 2005/0048789 (2005-03-01), Merry et al.
patent: 0822582 (1998-02-01), None
patent: 0964456 (1999-12-01), None
patent: 1376683 (2004-01-01), None
European Search Report, EP 05425930, May 10, 2006.
Sarkar Asok K
Schwabe Williamson & Wyatt
Slutsker Julia
LandOfFree
Process for digging a deep trench in a semiconductor body... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for digging a deep trench in a semiconductor body..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for digging a deep trench in a semiconductor body... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4101745