Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1994-07-07
1998-08-25
Nguyen, Nam
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20419228, 20419229, 20429826, C23C 1434
Patent
active
057980276
ABSTRACT:
A rotary cylindrical sputtering system incorporates separate, separately-controlled linear magnetron sputter deposition and reaction zones for sputter depositing materials such as refractory metals and forming oxides and other compounds and alloys of such materials. In one aspect, the associated process involves rotating or translating workpieces past the differentially pumped, atmospherically separated, sequentially or simultaneously operated deposition and reaction zones and is characterized by the ability to form a wide range of materials, by high throughput, and by the ability to form durable optical quality thin films of nominal refractive indices and controlled coating thickness, including both constant and selectively varied thickness profiles.
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Lefebvre Paul M.
Manley Barry W.
Scobey Michael A.
Seddon Richard Ian
Seeser James W.
Nguyen Nam
Optical Coating Laboratory, Inc.
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