Process for depositing metal contacts on a buried grid solar...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C136S256000, C438S073000, C438S098000, C438S687000

Reexamination Certificate

active

06881671

ABSTRACT:
A buried grid solar cell is manufactured by a process for metallising one or more metal contacts of a buried grid solar cell having a body of doped semiconductor material, wherein the electrical contact(s) is/are provided by conducting material being arranged in a pattern of one or more grooves into the semiconductor material by an electrolytic metal deposition process comprising a conventional electrolytic bath containing a special combination of per se known additives.

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G. Arabito et al., “Electroless Metallizations For Contracts In Buried Structures”, 2ndWorld Conference And Exhibition On Photovoltaic Solar Energy Conversion, vol. ii, pp. 1558-1561, (1998).
Shaoqi He, et al., “Laser Grooved Buried Contact Solar Cell”, 2ndWorld Conference And Exhibition On Photovoltaic Solar Energy Conversion, vol. II, pp. 1446-1448, (1998).
R. Kuhn, et al., “Multicrystalline Buried Contact Solar Cells Using A New Electroless Plating Metallization Sequence And A High Throughput Mechanical Groove Formation”, 14th European Photovoltaic Solar Energy Conference, vol. I, pp. 672-677, (1997).
A.U. Ebong, et al., “A Low Cost Metallization Scheme For Double Sided Buried Contact Silicon Solar Cells”, Solar Energy Materials And Solar Cells, vol. 31, pp. 499-507, (1994).
J.D. Jensen, et al., “Advances In Electrochemical Deposition Of Copper Interconnects On High-Efficiency Silicon-Based Phovoltaic Cells—A Progress Report”, 16th European Photovoltaic Solar Energy Conference, (2000).
R.D. Mikkola, et al., “Copper Electroplating For Advanced Interconnect Technology”, Plating and Surface Finishing, pp. 81-85, Mar. 2000.

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