Process for defining organic sidewall structures

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156646, 156648, 156652, 156655, 1566591, 156668, 20419236, 437228, 437235, B44C 122, B29C 3700, C03C 1500, C03C 2506

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048389919

ABSTRACT:
A conformal organic layer is used to define spacers on the sidewalls of an organic mandrel. The organic layer (e.g., parylene) can be deposited at low temperatures, and as such is compatible with temperature-sensitive mandrel materials that reflow at high deposition temperatures. The conformal organic material can be dry etched as the same rate as the organic mandrels, while being resistant to wet strip solvents that remove the organic mandrels. This series of etch characteristics make the organic mandrel-organic spacer combination compatible with a host of masking applications.

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patent: 4502914 (1985-03-01), Trumpp et al.
patent: 4599790 (1986-07-01), Kim et al.
patent: 4600686 (1986-07-01), Meyer et al.
patent: 4631113 (1986-12-01), Donald
patent: 4648937 (1987-03-01), Ogura et al.
patent: 4707218 (1987-11-01), Giammarco et al.
"Fabrication of a Sub-Minimum Lithography Trench," IBM Technical Disclosure Bulletin, vol. 29, No. 6, Nov. 1986, pp. 2760, 2761.
"Advanced Groundrule Processing Performed with Currently Available Photo-Lithographic Tools," IBM Technical Disclosure Bulletin, vol. 29, No. 9, Feb. 1987, pp. 3928-3929.
"Self-Aligned VMOS Structure Using Reactive Ion Etching," R. C. Varshney, IBM TDB, vol. 22, No. 8B, Jan. 1980, pp. 3705-3706.

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