Process for creating vias using pillar technology

Details Process for creating vias using pillar technology Process for creating vias using pillar technology

1998-07-06

1999-07-27

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257762, 257763, 257764, 257760, H01L 2348, H01L 2144

Patent

active

059295252

ABSTRACT:
A process for creating metal pillar via structures, used to interconnect multilevel metallizations, has been developed. The process features the creation of a via hole, in a thin dielectric layer, exposing the top surface of an underlying first level metallization structure. The metal pillar via structure is next formed, contacting the first level metallization structure, exposed in the opened via hole in the thin dielectric layer. The spaces between the metal pillar via structures are filled with a composite dielectric material, featuring a spin on glass layer, which provides partial planarazation. The planarazation process is completed via a chemical mechanical polishing process, which also exposes the top surface of the metal pillar via structure, making the metal pillar via structure easily accessible for contact for subsequent, overlying metallization structures.

REFERENCES:
patent: 4917759 (1990-04-01), Fisher et al.
patent: 5262354 (1993-11-01), Cote et al.
patent: 5306952 (1994-04-01), Matsuura et al.
patent: 5312512 (1994-05-01), Allman et al.
patent: 5616519 (1997-04-01), Ping
patent: 5639692 (1997-06-01), Teong
patent: 5654589 (1997-08-01), Huang et al.

Affiliated with

Also associated with

Rating

Process for creating vias using pillar technology does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for creating vias using pillar technology, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for creating vias using pillar technology will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-882073