Process for coating a substrate with electrically conductive mat

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

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20419215, C23C 1434

Patent

active

050062131

ABSTRACT:
A DC source 10 is connected to an electrode 5 disposed in a coating chamber 15a which can be evacuated and this electrode is electrically connected to an aluminum target 3 which is sputtered by introduction of a process gas and the sputtered particles deposited onto a plastic substrate. During the coating process hydrogen and/or water vapor are supplied to the cathode area from a container 32 via a system of pipes 30 to increase the adhesive strength of the sputtered layer 2 on the substrate 1.

REFERENCES:
patent: 4322276 (1982-03-01), Meckel et al.
patent: 4413877 (1983-11-01), Suzuki et al.
patent: 4572842 (1986-02-01), Dietrich et al.

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