Process for chemical vapor codeposition of copper and aluminum a

Details Process for chemical vapor codeposition of copper and aluminum a Process for chemical vapor codeposition of copper and aluminum a

1995-02-06

1995-11-07

Pianalto, Bernard

Coating processes

Direct application of electrical, magnetic, wave, or...

Plasma

427252, 4272552, 427314, 427585, B05D 306

Patent

active

054646669

ABSTRACT:
The present invention is a method for the simultaneous codeposition of copper and aluminum from volatile copper and aluminum precursors to form a layer on a substrate under chemical vapor phase conditions, such as the metallization of an aluminum/(0.25-4% copper) layer on a silicon semiconductor electronic device.

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