Process for chemical-mechanical polishing of metal substrates

Details Process for chemical-mechanical polishing of metal substrates Process for chemical-mechanical polishing of metal substrates

2006-07-18

2006-07-18

Morgan, Eileen P. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S036000, C451S287000, C438S692000, C438S693000, C156S345110, C156S345120

Reexamination Certificate

active

07077727

ABSTRACT:
Abrasive composition for the chemical-mechanical polishing in one stage of substrates used in the microelectronics semiconductors industry containing at least one metal layer and one insulator layer, comprising an acid aqueous suspension of individualized particles of colloidal silica, not linked to each other by siloxane bonds, having a mean particle diameter of between 5 and 20 nm and an oxidizing agent, and chemical-mechanical polishing process using such a composition.

REFERENCES:
patent: 5858813 (1999-01-01), Scherber et al.
patent: 6043159 (2000-03-01), Jacquinot et al.
patent: 6267909 (2001-07-01), Currie et al.
patent: 6375552 (2002-04-01), Cadien et al.
patent: 6479374 (2002-11-01), Ioka et al.
patent: 6692546 (2004-02-01), Ma et al.

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