Process for braze attachment of electronic package members

Details Process for braze attachment of electronic package members Process for braze attachment of electronic package members

1981-12-31

1989-04-25

Rowan, Kurt

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228232, B23K 3102

Patent

active

048240095

ABSTRACT:
In the process of braze attachment of electronic package members, such as attaching metallic coated connector pins to a multilayer ceramic substrate, contact areas of the substrate are formed by sequential coatings of molybdenum and nickel, which are heated to diffuse the nickel. A pure gold paste is applied by screen printing, for example, followed by the step of firing to burn out the paste binder and to sinter the pure gold particles onto a dense low porosity structure. The sintering operation converts the Ni film into a continuous Au-Ni solid solution. During pin braze, Ni-Sn intermetallics are dispersed in a gold rich matrix of the Au-Ni solid solution.

REFERENCES:
patent: 3006069 (1961-10-01), Rhoads et al.
patent: 3053699 (1962-09-01), Irons
patent: 3199189 (1965-08-01), La Plante
patent: 3340602 (1967-09-01), Hontz
patent: 3496630 (1970-02-01), Duff
patent: 3648357 (1972-03-01), Green
patent: 4238848 (1980-12-01), Yamaguchi
patent: 4291815 (1981-09-01), Gordon
patent: 4418857 (1983-12-01), Ainslee
IBM TECH. DISCL. BULL., vol. 20, No. 8, Jan. 1978, p. 3079, "Depositing Crack-Free Heavy Electroless Nickel Coating", Haddad et al.

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